November 2016 – AISMALIBAR is happy to announce they are exhibiting at the Electronica trade show in Munich, Germany on November 8-11. Electronica is the leading electronics manufacturing showcase in Europe. AISMALIBAR will be located in HALL B-4 BOOTH 134 and encourage attendees to come see their cutting edge thermal management solutions.
AISMALIBAR will be launching CURED BOND SHEETS, their newest high technology prepreg solution. This prepreg material can substitute silicon materials to act as a thermal interface material between the COBRITHERM HTC product range and the heatsink.
AISMALIBAR will also be showcasing FASTHERM, their newest high technology Insulated Metal Substrate. FASTHERM was developed by AISMALIBAR to achieve a faster thermal transition from the LED thermal pad to the heat sink.
This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper/aluminium base. By using AISMALIBAR COBRITHERM HTC range together with FASTHERM technology, LEDs operate at a temperature 30ºC to 50ºC lower due to the direct thermal transition from the thermal pad to the heat sink.
Managing Director, Eduardo Benmayor states, “We are very excited to be participating in Electronica 2016 and to be launching our newest prepreg techonology, Cured Bond Sheets. The PCB industry is always moving very fast and we are determinded to continue to position ourselves as a leader in thermal solutions.”